Two-sided PCB is mainly to solve the complex design and area of the limit, on both sides of the board to install components.
As a kind of FPC circuit board, multilayer PCB is more and more widely used in electronic industry nowadays. Now, with the application of the computer gradually popular, Double PCB because of the high functional demand, make the wiring capacity, transmission characteristics of FPC Multilayer board to focus on the demand.
It refers to the method of making multilayer PCB, it is usually done by the inner layer graphics first, then by printing etching method as single-sided or double-sided substrate, Double PCB and into the designated Interlayer, then heated, pressurized and bonded. As a matter of fact, these basic production methods have not changed much from those of the 1960 's, but as materials and process technology become more mature, Double PCB the characteristics of the attached multilayer board are becoming more diversified.
Compared to other forms of PCB, multilayer PCB can increase the number of wiring layer, thus increase the design flexibility, because of high assembly density, the connection between the components is reduced, thus improving the reliability. In addition, the device can also set up circuits, Double PCB magnetic circuit shielding layer, as well as metal core heat dissipation layer to meet the shielding, heat and other special functions need. Of course, multilayer PCB is not completely without defects. High cost, long cycle, the need for high reliability of detection means, these costs above will require greater pay.
In short, with the development of electronic technology, in particular, large-scale and VLSI widely used in-depth, FPC series of multilayer PCB is fast to high-density, high-precision, Double PCB high level of digital direction of the development of micro-lines, small aperture penetration, blind hole buried hole, high plate thick aperture ratio and other technologies to meet the needs of the market.
